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Figure 1 (a) and (b).The significant difference between compound morphology at
the interface of the traditional Sn-Cu/Cu and that of SC-Co-Ni-(p)/Cu

(a)Sn-0.7Cu (b)SC-Co-Ni-P
Figure 2 The morphology of IMC after ahing at 250℃ for 24h

Figure 3. The results of the creep resistance test at the joint of Sn-0.7Cu
and SC-Co-Ni-P respectively after high temperature aging at 150℃ for 24h

Figure 4. The wettability test results of the two kinds of alloys on the surface of copper.

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